Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same

ABSTRACT

An antenna pattern frame includes an antenna radiator receiving an external signal and transmitting the received external signal to an electronic device, a radiator frame having the antenna radiator on a surface thereof, and a guide boss protruding from the radiator frame and preventing the radiator frame from moving vertically in a mold for manufacturing an electronic device case having an inner space having a shape corresponding to that of an electronic device case.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2009-0073353 filed on Aug. 10, 2009, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an antenna pattern frame enabling anantenna pattern to be embedded in an electronic device case, a methodand mold for manufacturing the same, and an electronic device caseemploying the antenna pattern frame.

2. Description of the Related Art

Mobile communications terminals such as cellular phones, personaldigital assistants (PDAs) and laptop computers, which support wirelesscommunications, are indispensable devices in modern society. Functionsincluding CDMA, wireless LANs, GSM and DMB have been added to thesemobile communications terminals. One of the most important componentsthat enable these functions to operate is associated with antennas.

Antennas being used in these mobile communications terminals haveadvanced from external antennas, such as rod antennas or helicalantennas, to internal antennas that are disposed inside of terminals.

External antennas are susceptible to damage by external shock, whileinternal antennas increase the volume of terminals.

In order to solve these problems, research has been undertaken tomanufacture antennas that are formed integrally with mobilecommunications terminals.

In order that antennas are formed integrally with terminals, a method ofbonding flexible antennas to terminal bodies using adhesives is used.Recently, a method of forming antenna films by molding has beenproposed.

However, when flexible antennas are bonded by simply using adhesives,the reliability of these antennas is reduced as the adhesivenessdecreases. Besides, this also causes harm to the appearance of theterminals, lessening emotional quality for consumers.

In addition, when antenna films are used, product stability can beensured. However, a process of bonding an antenna to a film is difficultto perform and manufacturing costs are also increased.

Moreover, when such antenna films undergo a molding process, theelasticity of the antenna films makes it to difficult to inject amolding solution into the mold while fixing the antenna films.

SUMMARY OF THE INVENTION

An aspect of the present invention provides an antenna pattern framehaving an antenna radiator on a surface thereof such that the antennaradiator is embedded in an electronic device case, and firmly fixed evenwhen a resin material is injected in a mold for manufacturing theelectronic device case, and a method and mold for manufacturing theantenna pattern frame.

An aspect of the present invention also provides a method formanufacturing an electronic device case, capable of improving theappearance of an electronic device case by injection-molding theelectronic device case in such away that an upper end of a guide boss,protruding from an antenna pattern frame in order to prevent thevertical movement of the antenna pattern frame disposed in a mold formanufacturing an electronic device case, is melted when a resin materialis injected.

According to an aspect of the present invention, there is provided anantenna pattern frame including: an antenna radiator receiving anexternal signal and transmitting the received external signal to anelectronic device; a radiator frame having the antenna radiator on asurface thereof; and a guide boss protruding from the radiator frame andpreventing the radiator frame from moving vertically in a mold formanufacturing an electronic device case having an inner space having ashape corresponding to that of an electronic device case.

The guide boss may make contact with the mold for manufacturing anelectronic device case, or form a fine gap with the mold formanufacturing an electronic device case.

The antenna radiator may include: an antenna pattern portion controllinga reception bandwidth of an external signal; and a connection terminalportion transmitting the received external signal to an electronicdevice, wherein the antenna pattern portion and the connection terminalportion are arranged in different planes of the radiator frame.

The antenna radiator may be bent to provide the connection terminalportion, the antenna pattern portion, and the connection portionconnected therebetween.

The radiator frame may have a curved portion with a curvature, and theantenna radiator may be flexible so that the antenna radiator isdisposed on the curved portion.

The antenna radiator may have a top at the same level as that of theradiator frame.

The guide boss may protrude from the radiator frame while having adecreasing sectional area.

The guide boss may have a body portion and a tip portion having asmaller area than the body portion.

The guide boss may be formed of the same material as a resin materialforming the electronic device case.

The guide boss may be formed of a material having a lower melting pointthan a resin material forming the electronic device case.

According to another aspect of the present invention, there is provideda method of manufacturing an antenna pattern frame, the methodincluding: placing an antenna radiator in an inner space of a mold formanufacturing an antenna pattern frame, the antenna radiator includingan antenna pattern portion receiving an external signal and a connectionterminal portion connected to a circuit board of an electronic deviceand transmitting to the received external signal to the electronicdevice, the antenna pattern portion and the connection terminal portionbeing arranged in different planes; and injecting a resin material inthe mold for manufacturing an antenna pattern frame so that a radiatorframe having the antenna radiator on a surface thereof is formed in theinner space of the mold for manufacturing an antenna pattern frame,wherein the resin material is injected up to a guide boss forming recessformed in the mold for manufacturing an antenna pattern frame.

The mold for manufacturing an antenna pattern frame may include upperand lower molds, and one of the antenna pattern portion and theconnection terminal portion may contact one of the upper and lower moldsand the other one of the antenna pattern portion and the connectionterminal portion may contact the other one of the upper and lower moldsso that a top of the antenna radiator is at the same level as that ofthe radiator frame.

The guide boss forming recess may have a sectional area decreasinginwardly of the mold for manufacturing an antenna pattern frame.

The guide boss forming recess may be stepped to have a reduced sectionalarea, such that a tip portion having a relatively small sectional areais formed inside the mold for manufacturing an antenna pattern frame.

According to another aspect of the present invention, there is provideda mold for manufacturing an antenna pattern frame, the mold including:an upper or lower mold receiving an antenna radiator including anantenna pattern portion receiving an external signal and a connectionterminal portion transmitting the external signal to an electronicdevice, the antenna pattern portion and the connection terminal portionbeing arranged in different planes; a resin material injection portionprovided through the upper mold, the lower mold, or the upper and lowermolds, the resin material injection portion through which a resinmaterial is injected into an inner space created between the upper andlower molds so that the resin material filling the inner spacetherebetween forms a radiator frame having the antenna radiator on asurface thereof when the upper and lower molds are joined; and a guideboss forming portion formed in the upper or lower mold, the guide bossforming portion in which a guide boss protruding from the radiator frameis formed while the radiator frame is formed in the inner space.

The guide boss forming portion may be a recess having a sectional areadecreasing in a depth direction of the mold for manufacturing an antennapattern frame.

The guide boss forming recess may be stepped to have a reduced sectionalarea, such that a tip portion with a relatively small sectional area isformed inside the mold for manufacturing an antenna pattern frame.

According to another aspect of the present invention, there is provideda method of manufacturing an electronic device case, the methodincluding: placing an antenna pattern frame in an inner space of a moldfor manufacturing an electronic device case, the antenna pattern frameincluding an antenna radiator including an antenna pattern portionreceiving an external signal and a connection terminal portiontransmitting the external signal to an electronic device, the antennapattern portion and the connection terminal portion being arranged indifferent planes; placing a guide boss formed on the antenna patternframe to make contact with or form a fine gap with one inner side of themold for manufacturing an electronic device case, so that the antennapattern frame is prevented from moving vertically in the mold formanufacturing an electronic device case; and injecting a resin materialin the inner space of the mold for manufacturing an electronic device toform an electronic device case having the antenna pattern portionembedded therein, wherein the resin material is injected at atemperature at which an end portion of the guide boss contacting themold is melted.

According to another aspect of the present invention, there is providedan electronic device case including: an antenna radiator including anantenna pattern portion receiving an external signal and a connectionterminal portion transmitting the external signal to an electronicdevice, the antenna pattern portion and the connection terminal portionbeing arranged in different planes; a radiator frame supporting theantenna radiator and including a guide boss protruding from the radiatorframe; and an exterior portion covering the radiator frame and having aboundary with the guide boss underneath a surface of the exteriorportion.

The guide boss may have a sectional area decreasing toward the exteriorportion.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a schematic perspective view, with a cut-out portion, of acase of a laptop computer, which is an electronic device having anantenna embedded therein, according to an exemplary embodiment of thepresent invention;

FIG. 2 is a schematic perspective view illustrating an antenna patternframe according to an exemplary embodiment of the present invention;

FIG. 3 is a cross-sectional view illustrating the antenna pattern framedepicted in FIG. 2;

FIG. 4 is a schematic enlarged view illustrating a first embodiment ofthe part A of FIG. 3;

FIG. 5 is a schematic enlarged view illustrating a second embodiment ofthe part A of FIG. 3;

FIG. 6 is a schematic cross-sectional view illustrating a mold formanufacturing an antenna pattern frame in order to illustrate a methodof manufacturing an antenna pattern frame according to an exemplaryembodiment of the present invention;

FIG. 7 is a schematic cross-sectional view illustrating how a resinmaterial is injected into the mold of FIG. 6;

FIG. 8 is a schematic cross-sectional view illustrating a method formanufacturing an electronic device case, which is used to perform amethod of manufacturing an electronic device case having an antennapattern radiator embedded therein, according to an exemplary embodimentof the present invention;

FIG. 9 is a schematic cross-sectional view illustrating how a resinmaterial is injected into the mold of FIG. 8; and

FIG. 10 is a schematic cross-sectional view illustrating a completedelectronic device case produced by a process depicted in FIG. 9.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Exemplary embodiments of the present invention will now be described indetail with reference to the accompanying drawings. The invention may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein. While thoseskilled in the art could readily devise many other varied embodimentsthat incorporate the teachings of the present invention through theaddition, modification or deletion of elements, such embodiments mayfall within the scope of the present invention.

In the drawings, like reference numerals in the drawings denote likeelements.

[Antenna Pattern Frame]

FIG. 1 is a schematic perspective view, with a cut-out portion, of acase of a laptop computer, which is an electronic device having anantenna embedded therein, according to an exemplary embodiment of thepresent invention. FIG. 2 is a schematic perspective view illustratingan antenna pattern frame according to an exemplary embodiment of thepresent invention. FIG. 3 is a cross-sectional view illustrating theantenna pattern frame depicted in FIG. 2.

Referring to FIGS. 1 through 3, an antenna pattern frame 200 is appliedto a case 120 of a laptop computer 100, which is an electronic device.The antenna pattern frame 200 may be applied to every electronic deviceusing an antenna, in addition to the laptop computer 100.

The antenna pattern frame 200 is used in order that an antenna radiator220 receiving an external signal may be disposed at or in the vicinityof the center of the inner section of the case 120 of the electronicdevice.

The antenna pattern frame 200, according to this embodiment, includesthe antenna radiator 220, an antenna radiator frame 210, and a guideboss 250.

The antenna radiator 220 is formed of a conductive material such asaluminum or copper. Further, the antenna radiator 220 may receiveexternal signals and transmit the received external signals to a signalprocessor of the electronic device 100. Further, the antenna radiator220 may include an antenna pattern portion 222, which is a meander lineantenna pattern, in order to receive external signals with variousbands.

Connection terminal portions 224 transmit the received external signalsto the electronic device, and may be formed by bending, forming ordrawing a portion of the antenna radiator 220. Alternatively, theconnection terminal portions 224 may be manufactured separately from theantenna radiator 220 and then be connected to the antenna radiator 220.

The radiator frame 210 may have a three-dimensional structure consistingof a straight portion 260 having a flat profile and a curved portion 240with a curvature. The antenna radiator 220 may have flexibility suchthat the antenna radiator 220 can be disposed along the curved portion240 of the radiator frame 210.

The radiator frame 210 is produced by injection molding. While theantenna pattern portion 222 may be formed on one side 210 a of theradiator frame 210, the connection terminal portions 224 may be formedon the other side 210 b opposite to the one side 210 a.

The antenna radiator 220, which is embedded in the electronic devicecase 120, has the antenna pattern portion 222 receiving external signalsand the connection terminal portions 224 transmitting the receivedexternal signals to the electronic device. Here, the antenna patternportion 222 and the connection terminal portions 224 may be arranged inthe different planes.

The one side 210 a of the radiator frame 210, on which the antennapattern portion 222 is formed, is bonded to the inside of the electronicdevice case 120, so that an antenna pattern can be embedded in theelectronic device case 120.

Alternatively, an antenna pattern may be embedded in the electronicdevice case 120 by placing the antenna pattern frame 200 in a mold andperforming insert molding.

Therefore, the antenna pattern frame 200 serves as a first injectionmolded part in the process of embedding the antenna radiator 220including the antenna pattern portion 222 in the electronic device case120.

The antenna radiator 220 and the radiator frame 210 may have the sameboundary, which increases the fluidity of materials, such as resin,during a second injection molding process in which the antenna patternframe 200 is placed within the mold after the first injection moldingprocess.

The antenna radiator 220 of the antenna pattern frame 200 may be bent toform the connection terminal portions 224, the antenna pattern portion222, and connection terminal portions 226 connected therebetween.

The connection terminal portions 226 may connect the antenna patternportion 222 and the connection terminal portions 224 to be arranged inthe different planes. The connection terminal portions 224 that are notembedded in the electronic device case may be exposed on the other side210 b of the antenna pattern frame 200.

That is, the radiator 220 is bent on the basis of the connectionportions 226 to form the antenna pattern portion 222 and the connectionterminal portions 224, so that the antenna radiator 220 can be realizedto have a three-dimensionally curved surface.

In order to support the antenna radiator 220 having thethree-dimensionally curved surface, radiator support portions 260 mayprotrude from the other side 210 b of the radiator frame 210.

The radiator support portions 260 can firmly support the connectionportions 226 and the connection terminal portions 224 that are exposedon the other side 210 b.

The guide boss 250 protrudes from the one side 210 a of the radiatorframe 210. The guide boss 250 prevents the radiator frame 210 frommoving vertically in a mold 500 (see FIG. 8) for manufacturing anelectronic device case having an inner space having a shapecorresponding to that of the electronic device case 120.

In order to prevent the vertical movement of the radiator frame 210 inthe mold 500 for manufacturing an electronic device case, the guide boss250 may contact the mold 500 or have a fine gap therebetween.

FIG. 4 is a schematic enlarged view illustrating a first embodiment ofthe part A of FIG. 3, and FIG. 5 is a schematic enlarged viewillustrating a second embodiment of the part A of FIG. 3.

FIGS. 4 and 5 illustrate embodiments of the guide boss 250.

The guide boss 250 of FIG. 4 protrudes from the radiator frame 210 whileits sectional area is gradually decreased in the protruding directionthereof.

The guide boss 250 of FIG. 5 has a body portion 252 and a tip portion254 that are stepped. The tip portion 254 has a smaller sectional areathan the body portion 252.

The guide boss 250 may be formed of the same resin material as that ofthe electronic device case 120 or a material having a lower meltingpoint than the resin material.

The tip portion 254 of the guide boss 250 is melted when injecting aresin material into a mold for injection-molding the electronic devicecase 120, so that the guide boss 250 becomes unrecognizable from theexterior portion (122, see FIG. 10) of the electronic device 120.Therefore, consumer emotional attraction regarding the appearance of theexterior portion 122 is improved.

[Method and Mold for Manufacturing Antenna Pattern Frame]

FIG. 6 is a schematic cross-sectional view illustrating a mold formanufacturing an antenna pattern frame in order to illustrate a methodof manufacturing an antenna pattern frame according to an exemplaryembodiment of the present invention. FIG. 7 is a schematiccross-sectional view illustrating how a resin material is injected intothe mold of FIG. 6;

Hereinafter, a method of manufacturing the antenna pattern frame 200according to an exemplary embodiment of the invention will be describedwith reference to FIGS. 6 and 7.

First, as shown in FIG. 6, the antenna radiator 220 has the antennapattern portion 222 and the connection terminal portions 224 that arearranged in the different planes. The antenna pattern portion 222receives external signals. The connection terminal portions 224 are incontact with the circuit board of the electronic device.

The antenna radiator 220 may have a three-dimensional structure.Specifically, the radiator 220 is bent to form the antenna patternportion 222 and the connection terminal portions 224, and the connectionterminal portions 226 connected therebetween.

After the antenna radiator 220 is provided, the antenna radiator 220 isplaced in an inner space 350 of the mold 300.

The inner space 350 is created when an upper mold 320 and a lower mold340 are joined. A recess, formed in the upper mold 320 or the lower mold340, becomes the inner space 350 when the upper mold 320 and the lowermold 340 are joined.

When the upper mold 320 and the lower mold 340 are joined, guide pins328, contact pins 326, or the guide pins 328 and the contact pins 326,formed in the upper mold 320 or the lower mold 340, are inserted into ormake contact with guide pin holes 225, contact pin holes 223, or theguide pin holes 225 and the contact pin holes 223, formed in the antennapattern portion 222, so that the antenna radiator 220 can be fixed inthe inner space 350.

A resin material is injected into the inner space 350 to form theradiator frame 210, so that the antenna pattern portion 222 is embeddedin the electronic device case 120.

Here, the inner space 350 of the upper or lower mold 320 or 340 iscurved so that the radiator frame 210 has a curved portion 240.

The resin material is injected so that the top of the radiator 220 is atthe same level as that of the radiator frame 210. Therefore, when theradiator frame 210 is put in the mold for injection molding in order tomanufacture the electronic device case 120 in which the antenna patternis embedded, the flowability of the resin can be improved.

The inner space 350 may have a guide boss recess 352 to form the guideboss 250 on the radiator frame 210.

The guide boss recess 352 may be formed by recessing the mold 300 whilehaving a gradually decreasing sectional area. Alternatively, the guideboss recess 352 may be stepped to be decreased inwardly in sectionalarea, and may have a tip-portion forming recess (not shown) formedinside the mold 350 and having a shape corresponding to that of the tipportion 254. Here, the tip-portion forming recess has a smallersectional area than the other portion of the guide boss recess 352.

The resin material, when injected, is filled up to the guide boss recess352 to thereby form the guide boss on the radiator frame 210.

Referring to FIGS. 6 and 7, the mold 300 for manufacturing the antennapattern frame 200 will be described in detail.

The mold 300 for manufacturing the electronic device case 120 having theantenna pattern portion 222 embedded therein according to an exemplaryembodiment of the invention may include the upper and lower molds 320and 340, the resin material injection portion 370, and a guide bossforming portion.

The antenna radiator 220 may be received between the upper and lowermolds 320 and 340 while the antenna pattern portion 222 receiving anexternal signal and the connection terminal portions 224 in contact withthe circuit board 140 of the electronic device are arranged in thedifferent planes.

The resin material injection portion 370 is a passage through which aresin material flows. The resin material injection portion may be formedin the upper mold 320, the lower mold 340 or the upper and lower molds320 and 340. When the upper and lower molds 320 and 340 are joined, theresin material is injected into the inner space 350 between the upperand lower molds 320 and 340 so that the resin material filling the innerspace 350 forms the radiator frame 210 that allows the antenna patternportion 222 to be placed within the electronic device case 120.

The inner space 350 between the upper and lower molds 320 and 340 mayhave a space allowing the radiator frame 210 to have the curved portion240.

The guide boss forming portion may be configured as a recess 352decreasing in sectional area in a depth direction of the mold 300. Theguide boss forming recess 352 may include the tip-portion forming recess(not shown) stepped inside the mold 300 to have a reduced sectional areaand having a shape corresponding to that of the tip portion 254 of FIG.5.

[Electronic Device Case and Method of Manufacturing Electronic DeviceCase]

FIG. 8 is a schematic cross-sectional view illustrating a method formanufacturing an electronic device case, which is used to perform amethod of manufacturing an electronic device case having an antennapattern radiator embedded therein, according to an exemplary embodimentof the present invention. FIG. 9 is a schematic cross-sectional viewillustrating how a resin material is injected into the mold of FIG. 8.FIG. 10 is a schematic cross-sectional view illustrating a completedelectronic device case produced by a process depicted in FIG. 9.

Referring to FIGS. 8 and 9, the electronic device case 120 having theantenna pattern radiator 220 embedded therein is manufactured in such away that the radiator frame 210 is arranged in the mold 500 formanufacturing an electronic device case that has the inner space 550having a shape corresponding to the case frame, and the resin materialis fed into the mold 550, thereby forming the radiator frame 210integrally with the electronic device case 120.

The radiator frame 210 and the electronic device case 120 may be formedintegrally with each other. That is, when the resin material isintroduced, the molded surface of the radiator frame 210 contacting theresin material is partially melted so that the radiator frame 210 andthe electronic device case 120 can be firmly coupled with each other.

Here, injection molding for manufacturing the antenna pattern frame 200is referred to as a first injection molding process, and injectionmolding for manufacturing the electronic device case 120 is referred toas a second injection molding process. As in the first injection moldingprocess, the movement of the antenna pattern frame 200 inside the mold500 needs to be prevented during the second injection molding process.

Here, the guide boss 250 protruding from the antenna pattern frame 200may contact or have a fine gap with one inner side of the mold 500 formanufacturing an electronic device case. The guide boss 250 prevents thevertical movement of the antenna pattern frame 200 in the mold 500 foran electronic device case.

Furthermore, the inner space 550 of the mold 500 may include a curvegeneration portion 524 that allows the electronic device case 120 to becurved.

As the resin material is fed into the mold 500, the upper end of theguide boss 250 is melted so that the antenna pattern frame 200 isunrecognizable from an exterior portion 122 of the case 120.

The mold of the electronic device case for manufacturing the electronicdevice case 120 having the antenna pattern embedded therein during thesecond injection molding process may include upper or lower mold 520 or540 and a resin material injection portion 570. The upper or lower mold520 and 540 receives the radiator frame 210 including the antennaradiator 220 having the antenna pattern portion 222 receiving anexternal signal and the connection terminal portions 224 making contactwith the circuit board of the electronic device while the antennapattern portion 222 and the connection terminal portions 224 are formedin the different planes. The resin material injection portion 570 isformed in the upper mold 520, the lower mold 540, or the upper and lowermolds 520 and 540. A resin material flows through the resin materialinjection portion 570 into the inner space 550 created when the upperand lower molds 520 and 540 are joined, so that the resin materialfilling the inner space 550 forms the electronic device case 120.

The electronic device case 120 produced by the above method and mold formanufacturing an electronic device case may include the antenna radiator220 including the antenna pattern portion 222 receiving an externalsignal and the connection terminal portions 224 making contact with thecircuit board of the electronic device and transmitting the externalsignal to the electronic device while the antenna pattern portion 222and the connection terminal portions 224 are formed in the differentplanes, the radiator frame 210 supporting the antenna radiator 220 andhaving the guide boss 250 protruding therefrom, and the exterior portion122 covering the radiator frame 210 having a boundary with the guideboss 25 underneath a surface of the exterior portion 122.

The guide boss 250 may have a sectional area reducing toward theexterior portion 122 as its end portion is melted due to the inflow ofthe resin material during the second injection molding process.

As set forth above, according to an antenna pattern frame, a method formanufacturing the same, and a method of manufacturing an electronicdevice case according to the exemplary embodiments of the invention, anantenna pattern frame is prevented from moving vertically in a mold formanufacturing an electronic device case, so that an antenna radiator canbe embedded stably in the electronic device case.

Furthermore, since the antenna radiator is embedded stably in theelectronic device case, detective antenna performance can be reduced.

In addition, a resin material, being injected into the mold formanufacturing an electronic device case, melts an end portion of a guideboss preventing the vertical movement of the antenna pattern frame inthe mold of the electronic device case, so that the boundary of theguide boss is unrecognizable from the appearance of the injection-moldedelectronic device case.

While the present invention has been shown and described in connectionwith the exemplary embodiments, it will be apparent to those skilled inthe art that modifications and variations can be made without departingfrom the spirit and scope of the invention as defined by the appendedclaims.

1. An antenna pattern frame comprising: an antenna radiator receiving anexternal signal and transmitting the received external signal to anelectronic device; a radiator frame having the antenna radiator on asurface thereof; and a guide boss protruding from the radiator frame andpreventing the radiator frame from moving vertically in a mold formanufacturing an electronic device case having an inner space having ashape corresponding to that of an electronic device case.
 2. The antennapattern frame of claim 1, wherein the guide boss makes contact with themold for manufacturing the electronic device case, or forms a fine gapwith the mold for manufacturing an electronic device case.
 3. Theantenna pattern frame of claim 1, wherein the antenna radiatorcomprises: an antenna pattern portion controlling a reception bandwidthof an external signal; and a connection terminal portion transmittingthe received external signal to an electronic device, wherein theantenna pattern portion and the connection terminal portion are arrangedin different planes of the radiator frame.
 4. The antenna pattern frameof claim 1, wherein the antenna radiator is bent to provide theconnection terminal portion, the antenna pattern portion, and theconnection portion connected therebetween.
 5. The antenna pattern frameof claim 1, wherein the radiator frame has a curved portion with acurvature, and the antenna radiator is flexible so that the antennaradiator is disposed on the curved portion.
 6. The antenna pattern frameof claim 1, wherein the antenna radiator has a top at the same level asthat of the radiator frame.
 7. The antenna pattern frame of claim 1,wherein the guide boss protrudes from the radiator frame while having adecreasing sectional area.
 8. The antenna pattern frame of claim 1,wherein the guide boss has a body portion and a tip portion having asmaller area than the body portion.
 9. The antenna pattern frame ofclaim 1, wherein the guide boss is formed of the same material as aresin material forming the electronic device case.
 10. The antennapattern frame of claim 1, wherein the guide boss is formed of a materialhaving a lower melting point than a resin material forming theelectronic device case.
 11. A method of manufacturing an antenna patternframe, the method comprising: placing an antenna radiator in an innerspace of a mold for manufacturing an antenna pattern frame, the antennaradiator including an antenna pattern portion receiving an externalsignal and a connection terminal portion connected to a circuit board ofan electronic device and transmitting to the received external signal tothe electronic device, the antenna pattern portion and the connectionterminal portion being arranged in different planes; and injecting aresin material in the mold for manufacturing an antenna pattern frame sothat a radiator frame having the antenna radiator on a surface thereofis formed in the inner space of the mold for manufacturing an antennapattern frame, wherein the resin material is injected up to a guide bossforming recess formed in the mold for manufacturing an antenna patternframe.
 12. The method of claim 11, wherein the mold for manufacturing anantenna pattern frame includes upper and lower molds, and one of theantenna pattern portion and the connection terminal portion contacts oneof the upper and lower molds and the other one of the antenna patternportion and the connection terminal portion contacts the other one ofthe upper and lower molds so that a top of the antenna radiator is atthe same level as that of the radiator frame.
 13. The method of claim11, wherein the guide boss forming recess has a sectional areadecreasing inwardly of the mold for manufacturing an antenna patternframe.
 14. The method of claim 11, wherein the guide boss forming recessis stepped to have a reduced sectional area, such that a tip portionhaving a relatively small sectional area is formed inside the mold formanufacturing an antenna pattern frame.
 15. A mold for manufacturing anantenna pattern frame, the mold comprising: an upper or lower moldreceiving an antenna radiator including an antenna pattern portionreceiving an external signal and a connection terminal portiontransmitting the external signal to an electronic device, the antennapattern portion and the connection terminal portion being arranged indifferent planes; a resin material injection portion provided throughthe upper mold, the lower mold, or the upper and lower molds, the resinmaterial injection portion through which a resin material is injectedinto an inner space created between the upper and lower molds so thatthe resin material filling the inner space therebetween forms a radiatorframe having the antenna radiator on a surface thereof when the upperand lower molds are joined; and a guide boss forming portion formed inthe upper or lower mold, the guide boss forming portion in which a guideboss protruding from the radiator frame is formed while the radiatorframe is formed in the inner space.
 16. The mold of claim 15, whereinthe guide boss forming portion is a recess having a sectional areadecreasing in a depth direction of the mold for manufacturing an antennapattern frame.
 17. The mold of claim 15, wherein the guide boss formingrecess is stepped to have a reduced sectional area such that a tipportion having a relatively small sectional area is formed inside themold for manufacturing an antenna pattern frame.
 18. A method ofmanufacturing an electronic device case, the method comprising: placingan antenna pattern frame in an inner space of a mold for manufacturingan electronic device case, the antenna pattern frame including anantenna radiator including an antenna pattern portion receiving anexternal signal and a connection terminal portion transmitting theexternal signal to an electronic device, the antenna pattern portion andthe connection terminal portion being arranged in different planes;placing a guide boss formed on the antenna pattern frame to make contactwith or form a fine gap with one inner side of the mold formanufacturing an electronic device case, so that the antenna patternframe is prevented from moving vertically in the mold for manufacturingan electronic device case; and injecting a resin material in the innerspace of the mold for manufacturing an electronic device to form anelectronic device case having the antenna pattern portion embeddedtherein, wherein the resin material is injected at a temperature atwhich an end portion of the guide boss contacting the mold is melted.19. An electronic device case comprising: an antenna radiator includingan antenna pattern portion receiving an external signal and a connectionterminal portion transmitting the external signal to an electronicdevice, the antenna pattern portion and the connection terminal portionbeing arranged in different planes; a radiator a frame supporting theantenna radiator and including a guide boss protruding from the radiatorframe; and an exterior portion covering the radiator frame and having aboundary with the guide boss underneath a surface of the exteriorportion.
 20. The electronic device case of claim 19, wherein the guideboss has a sectional area decreasing toward the exterior portion.